Unraveling DNA packaging
Researchers report how high-speed atomic force microscopy can be used for studying DNA wrapping processes. The technique enables visualizing the dynamics of DNA-protein interactions, which in certain cases resembles the motion of inchworms......»»
Wildfire smoke is unraveling decades of air quality gains
Wildfire smoke now exposes millions of Americans each year to dangerous levels of fine particulate matter, lofting enough soot across parts of the West in recent years to erase much of the air quality gains made over the last two decades......»»
OSATs see uncertainty in new GPU orders from Nvidia, AMD
Taiwan's OSATs remain uncertain about the arrival of orders from Nvidia and AMD for processing their new GPU chips, and are expected to see their high-end packaging and testing capacities prepared for the new offerings stay idle for a while, accordin.....»»
Ledtech strives to maintain gross margin
LED packaging service provider Ledtech Electronics intends to keep its gross margin stable in the second half of 2022, during which revenue will likely come below that for the first half, according to sources at the Taiwan-based company......»»
MediaTek to mass produce HPC chips with CoWoS tech in 2023
MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply chain sources......»»
Equipment demand for advanced packaging stays robust
Equipment demand for mid- to high-end flip-chip (FC) and other advanced packaging remains robust, while demand for conventional wirebonding packaging is slowing down, according to sources at semiconductor packaging equipment suppliers......»»
Chip industry seeks an ecosystem-wide solution as ESG catches up with Moore"s Law
With traditional OSAT providers, IDMs and foundries like Intel, TSMC and ASE heading into advanced packaging technologies to tap the growing high performance computing market, concerns about sustainability have started to drive industry trends. Accor.....»»
Pioneering mathematical formula paves way for exciting advances in health, energy, and food industry
A groundbreaking mathematical equation that could transform medical procedures, natural gas extraction, and plastic packaging production in the future has been discovered......»»
Everlight expects car-use LED device orders to remain strong till end of 2022
LED packaging service provider Everlight Electronics has seen strong demand for car-use LED devices and expect orders to remain strong until the end of 2022, becoming the main source of growth in 2022 consolidated revenue......»»
Topco Scientific eyeing 3rd-gen semiconductor business
Topco Scientific, which mainly distributes photoresist, silicon wafers and CMP slurry products to foundry houses, is looking to actively develop its third-generation semiconductor business and deepen its presence in the segment of advanced packaging.....»»
Innolux stepping into IC packaging
Innolux will remodel a 3.5G LCD panel factory to house an IC packaging line, with production to begin in second-half 2023, according to company president James Yang......»»
Backend houses see limited impact from tightened US chip export rules to China
Taiwan-based IC packaging and testing houses expect new restrictions imposed by the US to cut China off from high-end artificial intelligence (AI) chips will have a limited impact on their businesses in China in the short term......»»
Unraveling the mysteries of the night sky with AI
Technische Universität Ilmenau (Germany) is using artificial intelligence to improve the detection and classification of unidentified phenomena in the night sky. The research team of the group for data-intensive systems and visualization collaborate.....»»
Harvatek expanding IC packaging biz
LED packaging service provider Harvatek will continue expanding its IC packaging capacity, expecting its IC packaging business to account for 15% of revenue by 2023 compared to less than 5% at present......»»
TSMC to boost advanced packaging capacity by 2026
TSMC expects to scale up its advanced packaging production capacity in 2022, which will be 300% greater than that in 2018, and to further boost the output by 2026 thanks to the commercialization of its 3D SoIC (system on integrated chips) technology......»»
Dubious iPhone 14 packaging leak claims 6GB RAM for all models
Ahead of Apple's unveiling of the iPhone 14 range, a social media poster claims to have shots of its packaging, and believes that all models will have 6GB RAM.It has been rumored before that all models in the iPhone 14 range will feature 6GB RAM. Whe.....»»
IC packaging material suppliers continue to see order pull-ins from ASE
ASE Technology Holding continues to step up its leadframe and other IC packaging materials procurement while other outsourced semiconductor assembly and test (OSAT) vendors are slowing down their purchases, according to industry sources......»»
Backend demand for automotive MCUs, MPUs stays robust
Backend demand for automotive MCUs and MPUs remains in high gear, with OSATs and packaging materials suppliers seeing clear order visibility through the end of this year, according to supply chain sources......»»
Don’t fall for this devious new Microsoft Office scam
With packaging looking legitimate enough at first glance, scammers are sending out fake Microsoft Office USB sticks -- loaded with ransomware -- to individuals......»»
Tong Hsing building new plant in Taiwan
CMOS image sensor (CIS) packaging service provider Tong Hsing Electronic Industries is constructing its fourth plant in northern Taiwan, with the facility to begin production in the first or second quarter of 2023 and focus on packaging automotive CI.....»»
SK Hynix aiming to break ground on US chip packaging facility in early 2023
It'd be a major win for the US as it continues to compete with rival chipmakers in China and move more chipmaking facilities stateside. SK Hynix is a subsidiary of SK Group and is the second largest semiconductor maker in South Korea behind Samsung......»»