Advertisements


Unraveling DNA packaging

Researchers report how high-speed atomic force microscopy can be used for studying DNA wrapping processes. The technique enables visualizing the dynamics of DNA-protein interactions, which in certain cases resembles the motion of inchworms......»»

Category: biomedSource:  sciencedailyJun 3rd, 2021

IC analysis and inspection demand robust for advanced-node chips, advanced packaging

Demand for materials analysis (MA) and reliability analysis (RA) services remains robust for chips built using advanced process manufacturing and advanced packaging, according to industry sources......»»

Category: itSource:  digitimesRelated NewsAug 11th, 2022

Silicon wafer, leadframe demand remains strong

Market demand for silicon wafers, IC packaging leadframes, and other related process materials remains strong, and chipmaking materials distributors including Topco Scientific, Wah Lee Industrial and Chang Wah Technology are all optimistic about thei.....»»

Category: itSource:  digitimesRelated NewsAug 10th, 2022

Open-source Acorn takes a new approach to deploy cloud-native apps on Kubernetes

Packaging and then deploying applications to run in cloud-native environments, with the Kubernetes container orchestration system, can be complex and Acorn aims to solve that. Packaging and then deploying applications to run in cloud-native envir.....»»

Category: topSource:  venturebeatRelated NewsAug 9th, 2022

Niching to post record 2022 profit

Niching Industrial, which distributes IC packaging materials, is expected to see its profits hit a record high in 2022 despite falling demand for display driver ICs, according to market sources......»»

Category: itSource:  digitimesRelated NewsAug 3rd, 2022

Competition heats up for advanced packaging among OSATs in Taiwan and China

In the advanced packaging field, the competition among OSATS on both sides of the Taiwan Straits, such as Taiwan-based ASE Technology Holding and China-based JCET Group, is heating up, according to industry sources......»»

Category: itSource:  digitimesRelated NewsAug 2nd, 2022

Edison Opto expects revenue proportion for automotive lighting to rise to 30-35% at end of 2022

LED packaging service provider Edison Opto expects the proportion of consolidated revenues for LED automotive lighting modules and lamps to rise from 25-30% in the first half of 2022 to 30-35% at the end of 2022, according to the company......»»

Category: topSource:  marketingvoxRelated NewsAug 1st, 2022

OSATs slowing down mature packaging capacity expansion

OSATs have started slowing down wirebonding and other mature packaging capacity expansions in response to waning chip demand for consumer applications, but leading players such as ASE Technology remain committed to building more capacity for processi.....»»

Category: itSource:  digitimesRelated NewsJul 27th, 2022

Apple semiconductor expert hired by Samsung in rare poaching

One of Apple’s semiconductor experts, Kim Woo-Pyeong, is going to work for a major competitor – Samsung Electronics. Woo-Pyeong is serving as director of the company’s newly established Packaging Solution Center in Device Solution America (DSA.....»»

Category: topSource:  marketingvoxRelated NewsJul 25th, 2022

Samsung poaches semiconductor expert from Apple

Semiconductor expert Kim Woo-pyeong has been hired away from Apple to run Samsung's new processor packaging solution center.Samsung's Packaging Solution Center is part of the company's wider Device Solution America (DSA) operations in Silicon Valley......»»

Category: appleSource:  appleinsiderRelated NewsJul 25th, 2022

India"s first memory chip ATMP plant reportedly to mass produce by December

Instead of selling memory chips for Japan- and US-based brands, Sahasra Semiconductors has decided to set up a memory chip assembly, test, and packaging (ATMP) unit in India and sell its own chips by December, which may be India's first memory chip A.....»»

Category: itSource:  digitimesRelated NewsJul 25th, 2022

Auto supplier Yanfeng saves millions with resusable cardboard

A packaging supplier is saving Yanfeng Automotive millions on its shipments from Mexico......»»

Category: topSource:  autonewsRelated NewsJul 23rd, 2022

Commerce Secretary Issues Stark Warning About Losing Access to Taiwan Fabs

A test wafer of "Meteor Lake" compute tiles for client on Intel 4 is displayed as part of the "Intel Accelerated" event on July 26, 2021. At the event, Intel presented the company's future process and packaging technolo.....»»

Category: topSource:  extremetechRelated NewsJul 22nd, 2022

Unraveling the mystery of the quasar"s "anisotropic" effects on surrounding gas

A team led by Prof. Toru Misawa of the School of General Education, Shinshu University found for the first time that the internal donut-shaped structure of the central nuclei of bright galaxies in the distant universe can have an "anisotropic" effect.....»»

Category: topSource:  physorgRelated NewsJul 22nd, 2022

Taiwan backend firms gearing up for next-gen HPC processors

Taiwan-based backend houses including flip chip (FC) packaging, high-end testing, and IC test interface specialists are gearing up production for upcoming high-performance computing (HPC) processors slated for launch later this year, according to ind.....»»

Category: itSource:  digitimesRelated NewsJul 22nd, 2022

Natural systems in Australia are unraveling. If they collapse, human society could too

In the long-delayed State of the Environment report released this week, there is one terrifying sentence: "Environmental degradation is now considered a threat to humanity, which could bring about societal collapses.".....»»

Category: topSource:  physorgRelated NewsJul 21st, 2022

CWTC sees QFP leadframe order visibility extended

Chang Wah Technology (CWTC) has seen the visibility of QFP (quad flat package) leadframe orders extended, buoyed by strong demand for automotive, industrial and network communication chips, according to the IC packaging leadframe supplier......»»

Category: topSource:  theglobeandmailRelated NewsJul 20th, 2022

TSMC on track to develop InFO_3D tech for mobile device chips

TSMC is on track to develop InFO_3D technology for processing mobile device chips that are going slimmer and lighter, looking to further expand its 3D Fabric lineup and serve more clients with its 3D chip stacking and advanced packaging technologies,.....»»

Category: itSource:  digitimesRelated NewsJul 18th, 2022

Advanced packaging demand remains brisk

Taiwan-based OSATs including ASE Technology and Powertech Technology (PTI) continue to see their midrange and high-end IC packaging manufacturing capacity utilization rates stay at high levels, as demand for HPC device applications remains promising,.....»»

Category: topSource:  informationweekRelated NewsJul 15th, 2022

Many kilotons of "recycled" Dutch plastic waste end up in the sea

On paper it is recycled, but in reality enormous quantities of plastic waste from the Netherlands end up in Asian seas. Researchers from the Leiden Institute of Environmental Sciences charted the fate of plastic food packaging waste from the Netherla.....»»

Category: topSource:  physorgRelated NewsJul 13th, 2022

Madison Review

With an elaborate set of puzzles to solve and no shortage of jolting jump scares to shock you with, unraveling the morbid central mystery of Madison is a bit like trying to evacuate an escape room while simultaneously struggling to prevent the vacuat.....»»

Category: gameSource:  ignRelated NewsJul 13th, 2022