Unraveling DNA packaging
Researchers report how high-speed atomic force microscopy can be used for studying DNA wrapping processes. The technique enables visualizing the dynamics of DNA-protein interactions, which in certain cases resembles the motion of inchworms......»»
TSMC and industry partners form 3DFabric Alliance focused on advancing chiplet architectures
The 3DFabric Alliance applies the combined expertise of multiple industry partners to create and refine chiplet-based design and packaging technologies. The 19-member alliance, which is expected to expand, spans the entire product ecosystem and inclu.....»»
Apple boasts iPad Pro packaging is 99% made from sustainable forests
Apple boasts iPad Pro packaging is 99% made from sustainable forests.....»»
Amkor signals auto semiconductor regional cluster strengthening in Europe
The semiconductor industry players are forming a regional cluster in Europe, with the support of EU's semiconductor initiative to decrease its dependence on Asia. Seeing growing demand for packaging and testing service in Europe, Amkor is pledging it.....»»
Everlight Electronics expected to see 15-20% drop in 2022 revenue
LED packaging service provider Everlight Electronics had consolidated revenues of NT$15.390 billion (US$513 million) for the first three quarters of 2022 slipping 20.12% on year, and is expected to see consolidated revenues for 2022 decrease 15-20% o.....»»
TSMC adds new variant to CoWoS packaging
TSMC is in talks with its major clients about the adoption of its new CoWoS-R+ packaging technology for HPC chips utilizing high-bandwidth memory such as HBM3, according to industry sources......»»
ASE cuts into medical care supply chain with SiP
ASE Technology has cut into the medical care industry supply chain with its system in a package (SiP) packaging for ultra-wideband (UWB) modules, according to industry sources......»»
TSMC sees utilization rates for advanced packaging loosen
TSMC has seen capacity utilization rates for advanced integrated fan-out (InFO) and chip-on-wafer-on-substrate (CoWoS) packaging start loosening in the fourth quarter of 2022, due to a slowdown in demand for HPC and smartphone chips, according to ind.....»»
China OSATs see capacity utilization rates plummet
China-based OSATs including JCET, Tianshui Huatian Technology and Tongfu Microelectronics have seen their capacity utilization rates plummet since the fourth quarter of 2022, due to falling wirebonding and other conventional packaging demand for matu.....»»
CWTC expects 12-16% sales decline in 4Q22
IC packaging leadframe specialist Chang Wah Technology (CWTC) expects to post a revenue decline of 12-16% sequentially in the fourth quarter of 2022......»»
How much will Nvidia’s RTX 4080 12GB unlaunch cost partners?
When Nvidia 'unlaunched' the GeForce RTX 4080 12GB, its AIB partners were already prepping and getting packaging printed for the release, a huge expense......»»
New security concerns for the open-source software supply chain
Open-source software is a critical element of the software supply chain in companies of all sizes, but there are new security concerns for the open-source software supply chain – calling for better approaches to packaging security, according to VMw.....»»
If you kept an original iPhone in the box, it might be worth $30,000
A 2007 iPhone sealed in its original packaging is up for auction, and is expected to sell for $30,000 or more.Image credit: LCG AuctionsLCG Auctions is holding its 2022 Fall Premier Auction until October 16. Among the many lots is an original iPhone.....»»
IC packaging leadframe demand to hit bottom in 1Q23
IC packaging leadframe and other materials demand is expected to hit bottom in the first quarter of 2023 and start recovering, according to industry sources......»»
LED makers under pressure of 4Q22 operating losses
In view of the continuous weak demand for TVs, IT products and consumer electronics, mainly due to impact of inflation, LED chip makers and packaging service providers are likely to suffer operating losses for the fourth quarter of 2022, according to.....»»
Samsung plans 1.4nm for 2027 while polishing up 3D packaging technology
At the annual Samsung Foundry Forum held in San Jose, California on October 3, Samsung announced its plan to introduce the 2nm process in 2025, and 1.4nm process in 2027. In light of the growing demand from HPC and automobile sectors, Samsung said th.....»»
Japanese semiconductor packaging material leader to expand production in China
Sumitomo Bakelite, a leading Japanese manufacturer of synthetic plastics used in IC packaging, has announced a plan to build a new factory in China, investing JPY6.6 billion (US$45 million) in total. The new factory is scheduled to complete in 2023,.....»»
IC packaging leadframe demand to drop further in 4Q22
IC packaging leadframe demand is expected to fall further in the fourth quarter of 2022 and shows no signs of recovery, as inventory adjustments for commodity chips are taking longer than expected, according to industry sources......»»
LED packaging house Ligitek experiences order deferral by clients
LED packaging service provider Ligitek Electronics has experienced order deferral by clients amid unfavorable macro conditions, expressing caution about its sales performance in the second half of 2022......»»
Intel"s new packaging facility settles in Italy
According to Reuters, Intel and Italy's outgoing government has picked the town of Vigasio in the country's northern Veneto region as the preferred site of Intel's planned state-of-the-art packaging facility. Reuters reported that the two parties alr.....»»
Apple Watch Ultra packaging, booklet, launch day pickup, more
The Apple Watch Ultra launches this Friday. While it was already known that it features new packaging (with first reviews already out), we got the chance to take a look at the new box, which includes a booklet. With an adventurous style, the Apple W.....»»