Unraveling DNA packaging
Researchers report how high-speed atomic force microscopy can be used for studying DNA wrapping processes. The technique enables visualizing the dynamics of DNA-protein interactions, which in certain cases resembles the motion of inchworms......»»
Leaked AMD Threadripper Pro 5000WX packaging shows one major change
AMD Threadripper Pro 5000WX could signal some significant changes......»»
Asia IC50: How do Taiwan OSAT companies retain market leadership?
Outsourced semiconductor assembly and test (OSAT) companies are crucial to the semiconductor industry in Taiwan. ASE Technology Holding leads the sector with endeavors in traditional and advanced packaging and advanced testing. The company was ranked.....»»
Leadframe supply for automotive IC packaging remains tight
Leadframe suppliers including Chang Wah Technology (CWTC), Jih Lin Technology and Shuen Der Industry (SDI) continue to see their supply for automotive IC packaging fall short of demand, according to industry sources......»»
OSATs cautious in handling contract violations by consumer chips vendors
Taiwan's OSATs are not only facing a notable decline in packaging demand for commodity MOSFET, MCU, PMIC and CMOS image sensors (CIS) for handset and PC applications, but also a situation where they have to decide how to deal with clients violating l.....»»
Backend firms see brisk order visibility for automotive chips
Backend packaging and testing houses continue to see stable growth in orders for automotive chips despite weakness in orders for consumer electronics chips, according to industry sources. Although demand related to consumer electronics ICs is expecte.....»»
ASML, TSMC shed lights on advanced solutions at CSTIC 2022
Heavyweight semiconductor players including sole EUV lithography equipment vendor ASML and top foundry TSMC have lately shed lights on latest front-end lithography and backend advanced packaging solutions, respectively, needed to extend the life cycl.....»»
Consumer IC packaging demand unlikely to rebound till 1Q23
Packaging demand for consumer electronics ICs including commodity MCUs, MOSFETs, lower-end logic ICs and power management ICs (PMICs) has contracted significantly amid lackluster sales of consumer electronic devices, and may not rebound until late fi.....»»
Semco to spend more on FCBGA substrate production
Samsung Electro-Mechanics (Semco) has announced plans to spend more on its FCBGA packaging substrate production in South Korea and Vietnam......»»
Nation"s most sweeping law to phase out single-use plastics approved by California lawmakers
Striking a blow against a pernicious form of pollution, California lawmakers on Thursday passed the nation's most far-reaching restrictions on single-use plastics and packaging, with Gov. Gavin Newsom expected to sign the bill Thursday......»»
MSScorps sees promising demand for advanced packaging, 3rd-gen semiconductors
IC analysis and inspection lab Material Science Service (MSScorps) is upbeat about its longer-term business prospects, citing brisk demand for advanced packaging and third-generation semiconductors......»»
People-powered research and experiential learning: Unraveling hidden biodiversity
Ask any scientist—for every "Eureka!" moment, there's a lot of less-than-glamorous work behind the scenes. Making discoveries about everything from a new species of dinosaur to insights about climate change entails some slogging through seemingly e.....»»
Harvatek, Bright LED conservative about 3Q22
LED packaging service providers Harvatek and Bright LED are conservative about third-quarter 2022 business as clients are expected to clear inventories and decrease orders, and inflation has been indirectly impacting demand for LED devices......»»
Spray-On, Rinse-Off Food "Wrapper" Can Cut Plastic Packaging
The coating deters microorganisms to fight both food waste and foodborne illness -- Read more on ScientificAmerican.com.....»»
TSMC orders to buoy GPTC, Kinik in 2022
With TSMC ramping up its sub-5nm process and advanced packaging manufacturing capacities, Grand Process Technology (GPTC) and Kinik are both seen the visibility of orders from the chipmaker extended beyond 2022, according to market sources......»»
ASE Technology obtains orders for EV charging piles
ASE Technology has obtained packaging orders for power modules used in electric vehicle (EV) charging piles while enjoying a ramp-up in orders for automotive microcontroller units (MCU), according to industry sources......»»
Challenges for semiconductor sector (6): The value of back-end business
Advanced packaging technology has become a powerful tool for TSMC to grab orders for advanced chips. Now Samsung Electronics has also announced that it will strengthen its back-end packaging and testing technology. As for the top 10 makers in the pac.....»»
Intel 4 is a Major Step on Intel’s Path Back to Semiconductor Dominance
A test wafer of "Meteor Lake" compute tiles for client on Intel 4 is displayed as part of the "Intel Accelerated" event on July 26, 2021. At the event, Intel presented the company's future process and packaging technolo.....»»
Unraveling sex determination in Bursaphelenchus nematodes: A path towards pest control
The sex and sexual characteristics constitute key aspects of an organism's life and are determined by a biological process known as sex determination. These ever-evolving mechanisms are broadly classified based on the type of "switch" that triggers t.....»»
Taiwan backend partners gear up for new AMD, Nvidia HPC chips
Leading CPU and GPU vendors AMD and Nvidia are all set to commercialize brand-new CPU and GPU platforms in 2023, and their backend partners in Taiwan are all gearing up to give full packaging and testing support for their new HPC chips, according to.....»»
Everlight to ship miniLED devices for automotive display backlighting
LED packaging service provider Everlight Electronics will begin to ship miniLED devices for automotive display backlighting in second-half 2022, according to company chairman Robert Yeh......»»