Unraveling DNA packaging
Researchers report how high-speed atomic force microscopy can be used for studying DNA wrapping processes. The technique enables visualizing the dynamics of DNA-protein interactions, which in certain cases resembles the motion of inchworms......»»
Backend firms see slow adoption of FC packaging among handset APs
The adoption of advanced fan-out packaging among handset application processors has been sluggish, according to sources at backend houses......»»
China LED packagers raise quotes by 10%
China-based LED packaging houses, including MLS and DSBJ, have raised their contract quotes by up to 10% starting May, according to industry sources......»»
Unraveling the mysteries of p62-bodies and the cellular recycling pathway
Our body functioning is delicately balanced between the synthesis and breakdown of various cellular components. When these cellular components grow old or get damaged, they are digested by a process called autophagy—literally, "self-eating." This p.....»»
LED firm Edison Opto steps up deployment in automotive segment
LED module and packaging service provider Edison Opto has stepped up its deployment in the automotive segment, with plans to add a new LED automotive lighting product line in June, according to company sources......»»
South Korean supplier of ABF substrate cleaning equipment penetrates Chinese market with innovative technology
South Korean semiconductor equipment supplier Neontech's new product, "TB Cleaning Saw & Sorter," a tool for ABF substrate packaging, has penetrated the Chinese market and won an order of US$6 million. The machine is set to see robust exports in 2H23.....»»
Utilization rates for COF packaging rise
Backend houses' production utilization rates for COF packaging have increased, boosted by a recovery in display driver IC (DDI) demand, according to industry sources......»»
Samsung reportedly to move FOWLP to volume production in 4Q23
Samsung Electronics is stepping up its deployment in the advanced packaging field, and reportedly will move its fan-out wafer-level packaging (FOWLP) technology to volume production in the fourth quarter of 2023......»»
Nvidia"s new mid-end gaming series to be mild boost to peripheral IC packaging & testing
The global consumer electronics market has faced sluggish end demand since the beginning of 2023. Sources anticipates suppliers to buoy the market with new product series this year, such as Nvidia's mid-end RTX 40 series......»»
Malaysia needs at least one medium-size wafer foundry fab, says MSIA president
Malaysia should strive to attract investors to set up at least one medium-size wafer foundry fab to build a complete semiconductor manufacturing supply chain in the country, not just as an IC packaging base in Southeast Asia for international semicon.....»»
JCET gearing up for automotive, chiplet demand boom
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based OSAT company, is gearing up for a surge in demand for automotive and chiplet solutions with its expanding system- and wafer-level, and 2.5D/3D advanced packaging technology por.....»»
Unraveling the mathematics behind wiggly worm knots
For millennia, humans have used knots for all kinds of reasons—to tie rope, braid hair, or weave fabrics. But there are organisms that are better at tying knots and far superior—and faster—at untangling them......»»
AMD partner, China-based packaging leader Tongfu Micro reported Q1 2023 results
Leading Chinese IC assembly and testing player Tonfgu Microelectronics has revealed its first-quarter 2023 results, seeing a revenue of CNY4.64 billion (US$670 million), up 3.11% YoY. Net profit was CNY4.55 million, down 97.24% YoY......»»
Unraveling the mechanism of green emission peaks in single polyfluorene chains
Molecular aggregates are clusters of small molecules held together by relatively weak forces believed to be originating from electronic interactions between the molecules. Owing to their exceptional photophysical properties, molecular aggregates find.....»»
UMC honorary vice chair sheds light on the development history of Taiwan as silicon island
Following half a century of development, Taiwan now has the world's most complete semiconductor industry clusters and professional division of labor, and ranks first globally in the foundry and packaging sectors and second in IC design, after the US......»»
CIS packaging house Tong Hsing less optimistic about automotive demand
Tong Hsing Electronic Industries has revised its automotive CIS business outlook from highly optimistic to just positive, according to the packaging house......»»
CIS packaging firm Tong Hsing becomes less optimistic about automotive demand
Tong Hsing Electronic Industries has revised its automotive CIS business outlook from highly optimistic to just positive, according to the packaging house......»»
Better recycling of plastic packaging: New process extracts fragrances
What doesn't smell good is hard to recycle. This simple rule also applies to the growing volume of plastic waste worldwide. One way to recycle it in an environmentally compatible and climate-friendly manner as high-quality post-consumer recyclates is.....»»
TSMC mulling first advanced packaging fab overseas
TSMC is mulling to setting up an advanced packaging fab in Japan, according to sources at fab toolmakers......»»
OSATs see handset IC demand remain sluggish
ASE Technology and other OSATs continue to experience low production utilization rates for flip-chip (FC) packaging, due to sluggish demand for handset ICs, according to industry sources......»»
3D fabric business pushes TSMC into top 3 largest OSATs
TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs......»»