Unraveling DNA packaging
Researchers report how high-speed atomic force microscopy can be used for studying DNA wrapping processes. The technique enables visualizing the dynamics of DNA-protein interactions, which in certain cases resembles the motion of inchworms......»»
Uber Eats will let you pick restaurants using less terrible packaging
Uber Eats is aiming to cut down on plastic waste in food deliveries by 2030. Announced on Thursday, customers ordering delivery through the Uber Eats app will be able to specifically search for cafes and restaurants that use less terrible, "reusable,.....»»
Tong Hsing eyes accelerating MOSFET biz dev: Q&A with company president C. S. Chang
Taiwan-based CMOS imagery sensor (CIS) packaging giant Tong Hsing Electronics, an affiliate of the Yageo Group, has been working actively to make adjustments to its shareholding in its joint venture XSemi with Foxconn Electronics (Hon Hai Technology.....»»
LED firms see revenue improve in May
Most Taiwan-based LED chipmakers and packaging houses, including Ennostar and Everlight, posted sequential revenue gains in May as demand from downstream customers began to warm up, according to industry sources......»»
TSMC opens new advanced backend fab
TSMC's Advanced Backend Fab 6, the foundry's first all-in-one automated advanced packaging and testing fab to realize 3DFabric front-end to back-end process and testing services integration, has opened......»»
OSATs eyeing chiplet opportunities
ASE Technology and other OSATs capable of providing advanced packaging technology are all gearing up for a boom in demand for chiplets......»»
Unraveling the role of the NiO electrocatalyst in alcohol electrooxidation reactions
A study led by Dr. Wei Chen, Prof. Yuqin Zou, and Prof. Shuangyin Wang (State Key Laboratory of Chemo/Bio-Sensing and Chemometrics, College of Chemistry and Chemical Engineering, Advanced Catalytic Engineering Research Center of the Ministry of Educa.....»»
CWTC likely to report higher-than-anticipated 2Q23 revenue
IC packaging leadframe supplier Chang Wah Technology (CWTC), which saw its monthly revenue exceed NT$1 billion (US$32.5 million) for the second consecutive month in May, is likely to report higher-than-anticipated revenue for the second quarter of 20.....»»
Apple UltraFusion relies on TSMC 3DFabric packaging technology
Apple's innovative UltraFusion packaging architecture relies on TSMC's 3DFabric packaging platform, according to industry sources......»»
Unraveling the historic journey of the mung bean: A tale of evolution, migration and climate adaptation
The mung bean, commonly known as green gram, has played a pivotal role as a cheap protein source in regions where access to meat is limited. Spanning over 4,500 years, the cultivation of this humble legume has sustained civilizations throughout its h.....»»
Unraveling brood parasitism in predatory mites
Several animal species display brood care, a phenomenon where 'caring' parents provide their offspring with food and protection against predators. However, there are many others that prefer not to do this, and instead sneak in their eggs with those o.....»»
TSMC: advanced packaging demand surpasses current capacity, expansion is speeding up
TSMC held its shareholders' meeting today, where chairman Mark Liu stated that the company has faced various global challenges in recent years, including the US-China trade war, climate change, the pandemic, and the Russia-Ukraine war. However, Liu n.....»»
TSMC rushes to increase packaging capacity for Nvidia AI chips
TSMC has placed rush orders for CoWoS packaging equipment in order to meet surging demand for Nvidia's AI chips, according to sources at fab toolmakers......»»
India"s Polymatech aims to become leading opto-semiconductor chips manufacturer
In response to the Indian government's Semiconductor Mission aimed at transforming the nation into a semiconductor powerhouse, several companies have shown interest in establishing assembly, testing, marking, and packaging (ATMP) facilities. Even tho.....»»
Advanced packaging demand for AI and HPC processors to rise
TSMC's CoWoS, ASE Technology's FOCoS, and other advanced packaging technologies are expected to draw an influx of orders for AI and HPC processors, according to industry sources......»»
SEMI: global semiconductor packaging materials market to reach US$29.8b by 2027
Semiconductor Equipment and Materials International (SEMI), TECHCET, and TechSearch International jointly published "Global Semiconductor Packaging Materials Outlook" report on May 24, predicting that the size of global semiconductor packaging and as.....»»
Despite market share loss, Japan IC substrate supplier influence on semi industry still strong, says DIGITIMES Research
As IC packaging trends toward high density and multiple layers, IC substrates that use Ajinomoto Build-up Film (ABF) as an insulation material (also called ABF substrates) are gaining market attention. Japan was once a major IC substrate provider, bu.....»»
Statuses of Japan IC substrate industry
As IC packaging trends toward high density and multiple layers, IC substrates that use Ajinomoto Build-up Film (ABF) as an insulation material (also called ABF substrates) are gaining market attention. Japan was once a major IC substrate provider, bu.....»»
Bright LED, Harvatek still see customers adjust inventory
LED packaging houses Bright LED Electronics and Harvatek continue to see customers adjusting their inventories in the second quarter, putting pressure on their operations. The firms said they will exert all-out efforts to develop new products in this.....»»
AUO Digitech transforms semiconductor assembly and packaging plants with smart upgrades
The semiconductor assembly and packaging industry has long struggled with labor-intensive processes. AUO Digitech (a subsidiary of AUO), specializing in smart industrial services, has stepped up to the plate by developing an innovative solution calle.....»»
Leadframe supplier CWTC opens new factory in southern Taiwan
Chang Wah Technology (CWTC) has inaugurated a new facility in Kaohsiung, southern Taiwan, where it will manufacture leadframes for advanced quad flat no-lead (aQFN) packaging, third-generation semiconductors and miniLED backlighting......»»