Unraveling DNA packaging
Researchers report how high-speed atomic force microscopy can be used for studying DNA wrapping processes. The technique enables visualizing the dynamics of DNA-protein interactions, which in certain cases resembles the motion of inchworms......»»
Pitaka Sunset Moment MagEZ 3 case review: Channelling those summer vibes
The limited edition Pitaka Sunset Moment case for iPhone 14 Pro weaves lightweight aramid fiber into a nostalgically retro design that's also very protective.Pitaka Sunset Moment MagEZ 3 case for iPhone 14 ProPitaka has upped its packaging game with.....»»
Demand for power module leadframes to see big rebound in 4Q23
Despite a slight correction in orders for automotive and industrial control applications, customers including IDMs are likely to restart their scramble for more supply of leadframes for packaging power modules in the fourth quarter of 2023, according.....»»
Cutting cable bacteria with a laser puts an end to a bacterial party
The party-poopers cutting the cable bacteria are researchers from the Center for Electromicrobiology (CEM) at Aarhus University. The center's work focuses on unraveling the mysteries of how cable bacteria work......»»
Mobile phone AP supply chain expects recovery in 3Q23
Semiconductor backend packaging and testing and mobile phone power amplifier (PA) companies agree that visibility for large-scale orders is still unclear going into the second quarter of 2023......»»
South Korea strengthens its eleven core industries; semiconductor sector targets advanced packaging under 1nm
The South Korean government has selected 40 R&D projects from 11 core investment sectors and plans to invest KRW13.5 trillion (around US$10.24 billion) by 2030. It will also give private corporations permission to lead the R&D projects......»»
AUO leads ecosystem partners toward commercialized Micro LED mass production
At Touch Taiwan 2023, AUO and its ecosystem partners will showcase a variety of modules, systems, and solutions ranging from LED chips, mass transfer technology, and packaging, highlighting its crucial milestone in the commercialization of Micro LED.....»»
Advanced packaging demand to be weak in 2023
Demand for advanced packaging has been weak so far in 2023 compared to previous years, with high-performance computing (HPC) chips showing better momentum than handset application processors (AP), according to industry sources......»»
Intel delivers MCP prototypes to US Department of Defense
Intel has announced delivery of the first multi-chip package (MCP) prototypes created under the state-of-the-art heterogeneous integrated packaging (SHIP) program......»»
Samsung steps up fan-out wafer-level packaging deployment
Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources......»»
Taiwan LED packaging houses see automotive products drive growth
Taiwan-based LED chipmakers and LED packaging houses, including Ennostar, Everlight, Brightek and Edison Opto, are expected to generate more revenue from automotive applications in 2023, according to industry sources......»»
Nvidia to embrace TSMC 3D SoIC tech
Nvidia is expected to use TSMC's 3D SoIC (system on integrated chips) stacking and chiplet packaging technology in its high-end processors set to debut between 2024 and 2025, according to sources in the IC backend market......»»
This rare iPhone just sold for more than a new car
Collectors are willing to pay a lot for the original iPhone if it's in its original packaging, and a recent auction brought an interesting variant to light......»»
This rare iPhone was just sold for more than a new car
Collectors are willing to pay a lot for the original iPhone if it's in its original packaging, and a recent auction brought an interesting variant to light......»»
Packaging substrate demand remains promising
The outlook of mid- to long-term demand for substrates supporting the packaging of HPC chips remains bright despite recent speculation that the market for related substrates is oversupplied......»»
Everlight expects profit growth in 2023
LED packaging service provider Everlight Electronics expects its profits to outperform 2022's levels this year, with the correspondent revenue staying flat or increasing slightly......»»
US Defense Production Act utilized to strengthen PCB and hypersonics industrial bases
On March 27, US President Joe Biden signed a presidential determination (PD) authorizing the use of Defense Production Act (DPA) to support the PCB and advanced packaging industries in the United States.....»»
US Defence Production Act utilized to strengthen PCB and hypersonics industrial bases
On March 27, US President Joe Biden signed a presidential determination (PD) authorizing the use of Defense Production Act (DPA) to support the PCB and Advanced Packaging industry in the United States.....»»
IC backend firms urged to expand production capacity in Southeast Asia
IC backend houses are being encouraged to increase production capacity in Southeast Asia, especially for BGA packaging, according to industry sources......»»
SK Hynix enhances its procurement department, highlights strategic value of packaging
To enhance the competitiveness of its back-end process "packaging," SK Hynix has divided its procurement department starting in 2023. For the first time, the procurement department has both a front-end and a back-end process team......»»
Natural-waste pads developed to keep packaged meat fresh
Pads incorporated into fresh meat packaging, whose function is to absorb the moisture generated in it, and that can cause food spoilage, are generally composed of plastic polymers derived from petroleum by-products......»»