Innolux stepping into IC packaging
Innolux will remodel a 3.5G LCD panel factory to house an IC packaging line, with production to begin in second-half 2023, according to company president James Yang......»»
TSMC mulling first advanced packaging fab overseas
TSMC is mulling to setting up an advanced packaging fab in Japan, according to sources at fab toolmakers......»»
Innolux moves to consolidate its outdated LCD fabs
Panel maker Innolux has revealed plans to consolidate its outdated LCD fabs as it focuses on niche-market products, according to company sources......»»
OSATs see handset IC demand remain sluggish
ASE Technology and other OSATs continue to experience low production utilization rates for flip-chip (FC) packaging, due to sluggish demand for handset ICs, according to industry sources......»»
Innolux sees losses narrow in 1Q23
Innolux saw its quarterly losses shrink considerably in the first quarter of 2023, thanks to a rebound in panel prices......»»
3D fabric business pushes TSMC into top 3 largest OSATs
TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs......»»
AUO, Innolux showcasing high-end display solutions at 2023 Touch Taiwan
Taiwan's top-2 panel makers AU Optronics (AUO) and Innolux continue to roll out new high-end display solutions. The former is showcasing the world's highest refresh rate on its 24-inch FHD 540Hz ultra-fast gaming display panel at the 2023 Touch Taiwa.....»»
Pitaka Sunset Moment MagEZ 3 case review: Channelling those summer vibes
The limited edition Pitaka Sunset Moment case for iPhone 14 Pro weaves lightweight aramid fiber into a nostalgically retro design that's also very protective.Pitaka Sunset Moment MagEZ 3 case for iPhone 14 ProPitaka has upped its packaging game with.....»»
Japan keen on building chiplet technology and ecosystem
While the Intel-initiated Universal Chiplet Interconnect Express (UCIe) consortium has attracted many participants, Japan's academic and industry players are also stepping up efforts to develop chiplet connection technology and build related ecosyste.....»»
Satellite mobile phones to boom
With Qualcomm and more chip vendors stepping up the development of satellite communication chips for smartphones, satellite phones are nearing commercialization, according to industry sources......»»
Demand for power module leadframes to see big rebound in 4Q23
Despite a slight correction in orders for automotive and industrial control applications, customers including IDMs are likely to restart their scramble for more supply of leadframes for packaging power modules in the fourth quarter of 2023, according.....»»
Mobile phone AP supply chain expects recovery in 3Q23
Semiconductor backend packaging and testing and mobile phone power amplifier (PA) companies agree that visibility for large-scale orders is still unclear going into the second quarter of 2023......»»
South Korea strengthens its eleven core industries; semiconductor sector targets advanced packaging under 1nm
The South Korean government has selected 40 R&D projects from 11 core investment sectors and plans to invest KRW13.5 trillion (around US$10.24 billion) by 2030. It will also give private corporations permission to lead the R&D projects......»»
AUO leads ecosystem partners toward commercialized Micro LED mass production
At Touch Taiwan 2023, AUO and its ecosystem partners will showcase a variety of modules, systems, and solutions ranging from LED chips, mass transfer technology, and packaging, highlighting its crucial milestone in the commercialization of Micro LED.....»»
AUO, Innolux to close part of LCD fabs
Taiwan's top two panel makers, AU Optronics (AUO) and Innolux, reportedly each plan to close a 5G and a 5.5G LCD fab by the end of 2023......»»
Advanced packaging demand to be weak in 2023
Demand for advanced packaging has been weak so far in 2023 compared to previous years, with high-performance computing (HPC) chips showing better momentum than handset application processors (AP), according to industry sources......»»
The future of Matter in 2023
Matter has big plans for the rest of 2023, but with no timetable for releases and Belkin stepping away, what can we realistically expect over the next months?.....»»
Intel delivers MCP prototypes to US Department of Defense
Intel has announced delivery of the first multi-chip package (MCP) prototypes created under the state-of-the-art heterogeneous integrated packaging (SHIP) program......»»
Samsung steps up fan-out wafer-level packaging deployment
Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources......»»
Taiwan LED packaging houses see automotive products drive growth
Taiwan-based LED chipmakers and LED packaging houses, including Ennostar, Everlight, Brightek and Edison Opto, are expected to generate more revenue from automotive applications in 2023, according to industry sources......»»
Nvidia to embrace TSMC 3D SoIC tech
Nvidia is expected to use TSMC's 3D SoIC (system on integrated chips) stacking and chiplet packaging technology in its high-end processors set to debut between 2024 and 2025, according to sources in the IC backend market......»»