Innolux stepping into IC packaging
Innolux will remodel a 3.5G LCD panel factory to house an IC packaging line, with production to begin in second-half 2023, according to company president James Yang......»»
This rare iPhone just sold for more than a new car
Collectors are willing to pay a lot for the original iPhone if it's in its original packaging, and a recent auction brought an interesting variant to light......»»
This rare iPhone was just sold for more than a new car
Collectors are willing to pay a lot for the original iPhone if it's in its original packaging, and a recent auction brought an interesting variant to light......»»
KAR Global"s Jim Hallett, former CEO, retires from executive chairman role
Hallett, 69, is also stepping down as chairman of the company's board of directors, a role he held since 2014. Michael Kestner, KAR Global's lead independent director since 2019, will assume that role April 1......»»
Packaging substrate demand remains promising
The outlook of mid- to long-term demand for substrates supporting the packaging of HPC chips remains bright despite recent speculation that the market for related substrates is oversupplied......»»
Everlight expects profit growth in 2023
LED packaging service provider Everlight Electronics expects its profits to outperform 2022's levels this year, with the correspondent revenue staying flat or increasing slightly......»»
US Defense Production Act utilized to strengthen PCB and hypersonics industrial bases
On March 27, US President Joe Biden signed a presidential determination (PD) authorizing the use of Defense Production Act (DPA) to support the PCB and advanced packaging industries in the United States.....»»
ASE steps up deployment in automotive electronics sector
Taiwanese OSAT ASE Technology Holding (ASE) continues to enhance its solutions for automotive ICs including sensors, electronic control units (ECU), and power devices, stepping up its deployments in the automotive electronics sector......»»
US Defence Production Act utilized to strengthen PCB and hypersonics industrial bases
On March 27, US President Joe Biden signed a presidential determination (PD) authorizing the use of Defense Production Act (DPA) to support the PCB and Advanced Packaging industry in the United States.....»»
IC backend firms urged to expand production capacity in Southeast Asia
IC backend houses are being encouraged to increase production capacity in Southeast Asia, especially for BGA packaging, according to industry sources......»»
SK Hynix enhances its procurement department, highlights strategic value of packaging
To enhance the competitiveness of its back-end process "packaging," SK Hynix has divided its procurement department starting in 2023. For the first time, the procurement department has both a front-end and a back-end process team......»»
Natural-waste pads developed to keep packaged meat fresh
Pads incorporated into fresh meat packaging, whose function is to absorb the moisture generated in it, and that can cause food spoilage, are generally composed of plastic polymers derived from petroleum by-products......»»
ACM Research talks about new orders, growth opportunities
ACM Research, a leading developer of wafer processing technologies for semiconductor and advanced wafer-level packaging applications, has secured its first purchase order from a major global semiconductor manufacturer based in Europe for its Ultra C.....»»
Apple is sitting on the sidelines as the AI battle heats up
Companies like Microsoft and Google have been stepping up their AI game by introducing new AI features in their products and services, but it has been kind of quiet on the Apple front, so either Apple needs to step it up or risk being left behind......»»
InnoCare leads in X-ray FPD segment
InnoCare Optoelectronics, a subsidiary of Innolux focusing on developing flat panels for medical applications, has claimed that it maintains a leading position in the X-ray flat panel detector (FPD) segment with a nearly 50% market share......»»
Belkin"s Matter woes, ESR Find My wallet, & more smart home news
Belkin is stepping back from the Matter standard, ESR got a new Find My-enabled Geo Wallet & Stand, and there is much more news on the Homekit Insider podcast.HomeKit InsiderAfter previously committing to Matter, Belkin is now putting its rollout on.....»»
CIS packagers enjoy stable demand for high-end auto applications
BGA (ball grid array) packaging demand for high-pixel and large-size automotive CMOS image sensor (CIS) chips remains in high gear, but lower-end car-use CIS products processed with wafer-level chip scale package (WLCSP) technology are showing signs.....»»
UFC 286 fight card: Who’s stepping into the Octagon tonight?
UFC 286: Edwards vs. Usman 3 has a star-studded roster with a championship trilogy bout serving as the headliner. Check out the full UFC 286 fight card here......»»
Taiwan panel, BLU makers growing non-panel businesses
Taiwan-based panel makers AU Optronics (AUO) and Innolux and backlight unit (BLU) supplier Coretronic have been keen on developing non-panel businesses, expecting related new businesses to start contributing significantly to their revenue growth......»»
Tesla turns Twitter into $44 billion communications apparatus
Many Tesla shareholders have called for Musk to revive Tesla’s PR department; instead, the carmaker has been stepping up its activity on Twitter......»»
CIS backend specialist Tong Hsing upbeat about automotive demand
CIS packaging and testing firm Tong Hsing Electronic is expected to see sales generated from the automotive applications register a high single-digit percentage growth in 2023......»»