Unraveling DNA packaging
Researchers report how high-speed atomic force microscopy can be used for studying DNA wrapping processes. The technique enables visualizing the dynamics of DNA-protein interactions, which in certain cases resembles the motion of inchworms......»»
Apple’s relationship with China ‘untenable’ but will take 20 years to unravel
Apple’s relationship with China has been described as “untenable,” as the company faces criticism from senators on both sides of the political aisle. But unraveling that relationship will take more than 20 years, according to one former Apple.....»»
Unraveling Auger recombination in bipolar devices under high carrier injection
Bipolar high-voltage devices based on silicon carbide (SiC) have been earmarked as the next big step in the development of more efficient power systems. The efficiency of these devices is largely dependent on minimizing the impact of various recombin.....»»
Chinese EDA leader revealed plans to develop chiplet and AI-based design automation
China-based electronic design automation (EDA) company Empyrean Technology has unveiled on January 12 that it has begun to undertake the research and development of chiplet-based advanced packaging as well as AI-based design automation......»»
Market Cap 100: ASE keeps deepening advanced packaging solution development
Taiwan-based ASE Technology Holding (ASEH) ranked 72 in the "2023 Asia Supply Chain Market Cap 100 Ranking," representing a significant improvement from the 81 it held a year earlier......»»
Nanoplastics unexpectedly produce reactive oxidizing species when exposed to light
Plastics are ubiquitous in our society, found in packaging and bottles as well as making up more than 18% of solid waste in landfills. Many of these plastics also make their way into the oceans, where they take up to hundreds of years to break down i.....»»
Everlight expects invisible LED demand to pick up in 1H23
LED packaging service provider Everlight Electronics expects demand for invisible LED devices to pick up gradually in the first half of 2023 and for other visible models to come one quarter later......»»
Unraveling the selective transport of sugar and a hormone that underlies male fertility in plants
Researchers at Nagoya University, Japan, have discovered a mechanism for the selective transportation of sugar and hormones in plants. The results also clarify that sugar transportation is necessary for male fertility in plants, which means pollen pr.....»»
Taiwan OSATs poised to slightly cut quotes for 2023
Taiwan's OSATs are expected to slightly cut packaging or testing quotes for 2023 to bolster their capacity utilization rates, with price ranges up for negotiation with clients to gradually return to pre-pandemic levels, according to industry sources......»»
Delivery lead times for IC packaging and testing machines shorten notably
Delivery lead times for IC packaging and testing machines have shortened notably amid weakening demand and improving supply of basic ICs used in the machines, according to industry sources......»»
France bans disposable packaging, utensils in fast-food restaurants
Fast-food eateries in France will soon no longer be able to use disposable containers, plates, cups and tableware for clients eating in, the latest measure from a 2020 law to combat waste and encourage recycling......»»
A challenge for Foxconn to venture into chiplet packaging segment
Foxconn Technology's (Hon Hai Precision Industry) latest announcement to invite Shang-Yi Chiang, TSMC veteran and former SMIC executive, as the chief strategy officer of its semiconductor group has brought both Chiang and the company into internation.....»»
Unraveling cell fate decisions through single cell methods and mathematical models
How does an embryonic stem cell decide if it becomes a heart cell or a kidney cell? That's the question computational biologist Maria Mircea studied for her Ph.D. research. She looked at the inside of individual cells to analyze how they change. This.....»»
Chengdu Silan raises CNY500 million to fund automotive IC packaging biz
Chengdu Silan Semiconductor Manufacturing, a subsidiary of discrete component IDM Silan Microelectronics, has raised CNY500 million (US$71.7 million) from two new Chinese investors to fund its automotive IC packaging business. Government-led Chengdu.....»»
Unraveling the relationship of alcohol and club culture in women"s amateur soccer
Soccer and alcohol is a constant topic in Melbourne and beyond, even between seasons. Players behaving badly on the turps is a standard club issue......»»
Samsung adjusts semiconductor department for advanced packaging ambition
Samsung Electronics's Device Solutions (DS) division recently adjusted its organization by adding an advanced packaging team under the Test & System Package (TSP) department, according to several industry sources. Analysis pointed out that these adju.....»»
Tata eyes chip packaging and fabrication business
Amid a chip shortage and the US-China political tension, Indian companies are foraying into semiconductor manufacturing, with Tata showing interest in ATMP and chip fabrication......»»
OSATs still uncertain about constructing facilities in US
Though TSMC is building advanced wafer fabs in the US, Taiwanese OSAT companies still have concerns about constructing facilities there to provide cutting-edge packaging services such as those for chiplets or mainstream flip-chip (FC) processes, acco.....»»
Japan looking to next-generation semiconductors, says JST president
While the US leads in IC design, Taiwan leads in wafer foundry and IC packaging/testing, and South Korea leads in DRAM/flash memory, Japan is focusing on development of next-generation semiconductors, according to president Hashimoto Kazuhito for Jap.....»»
Intel unveils 2D and 3D IC research breakthroughs to extend Moore"s Law
At the IEEE International Electron Device Meeting (IEDM) 2022, Intel unveiled research breakthroughs in 2D and 3D IC packaging technologies fueling its innovation pipeline for keeping its promises to put a trillion transistors on an integrated circui.....»»
DDI packaging materials suppliers land pull-in of short lead-time orders
Display driver IC packaging materials suppliers have recently landed a pull-in of short lead-time orders, which DDI backend firms regard as a short-term phenomenon......»»