Unraveling DNA packaging
Researchers report how high-speed atomic force microscopy can be used for studying DNA wrapping processes. The technique enables visualizing the dynamics of DNA-protein interactions, which in certain cases resembles the motion of inchworms......»»
Natural-waste pads developed to keep packaged meat fresh
Pads incorporated into fresh meat packaging, whose function is to absorb the moisture generated in it, and that can cause food spoilage, are generally composed of plastic polymers derived from petroleum by-products......»»
ACM Research talks about new orders, growth opportunities
ACM Research, a leading developer of wafer processing technologies for semiconductor and advanced wafer-level packaging applications, has secured its first purchase order from a major global semiconductor manufacturer based in Europe for its Ultra C.....»»
Unraveling nature"s chorus: AI detects bird sounds in Taiwan"s montane forests
Montane forests, known as biodiversity hotspots, are among the ecosystems facing threats from climate change. To comprehend potential impacts of climate change on birds in these forests, researchers set up automatic recorders in Yushan National Park,.....»»
CIS packagers enjoy stable demand for high-end auto applications
BGA (ball grid array) packaging demand for high-pixel and large-size automotive CMOS image sensor (CIS) chips remains in high gear, but lower-end car-use CIS products processed with wafer-level chip scale package (WLCSP) technology are showing signs.....»»
CIS backend specialist Tong Hsing upbeat about automotive demand
CIS packaging and testing firm Tong Hsing Electronic is expected to see sales generated from the automotive applications register a high single-digit percentage growth in 2023......»»
IC backend equipment specialist K&S to see U-shaped demand recovery
The semiconductor backend packaging and testing industry chain, while facing a business correction currently, is likely heading for a "U-shaped recovery" in the second half of 2023, according to Chan Pin Chong, executive VP and GM of Kulicke and Soff.....»»
Two new companies want a piece of Apple"s 5G modem business
Two firms are reportedly competing to handle the final packaging of Apple's in-house 5G modem for future iPhone models.Apple currently uses 5G modems supplied by Qualcomm, with that partnership expected to end with the 2023 iPhone 15 lineup. After ye.....»»
Former TSMC R&D executive joins Samsung
Lin Jun-cheng, who previously worked in TSMC's advanced packaging and testing department, has been appointed as Samsung Electronics' VP of advanced packaging business, raising concerns that the appointment may pose a threat to TSMC in the advanced pa.....»»
LED makers Laster, Edison Opto step up investment in Taiwan
Taiwan-based LED makers, including automotive lighting module maker Laster Tech and packaging service provider Edison Opto, have stepped up factory expansions in Taiwan amid the growing trade dispute between the US and China......»»
Is biodegradable better? Making sense of "compostable" plastics
Bacardi rum bottles, Skittles sweet wrappers, designer water bottles—a bevy of companies are developing biodegradable plastic packaging they say is better for the environment than traditional plastics......»»
JCET provides customers with advanced packaging HVM solutions for 4D mmWave radar
JCET recently announced that it provides advanced packaging HVM solutions for 4D millimeter-wave (mmWave) radar to multiple customers in order to meet the increasingly diverse and customized demands of automotive electronic applications......»»
High-end AI chip boom to spur demand for TSMC CoWoS packaging
A surge in high-end AI chip demand spurred by the growing popularity of ChatGPT is expected to drive demand for TSMC's CoWoS packaging, according to industry sources......»»
Microsoft reportedly mulls utilizing TSMC CoWoS for AI chip
Microsoft has reportedly approached TSMC and its ecosystem partners about using the foundry's CoWoS packaging for its own AI chip, according to industry sources......»»
China OSATs drop prices for mature ICs
Chinese OSATs JCET, Tongfu Microelectronics, and HT-Tech are reportedly lowering prices to attract orders for mature ICs while also making progress in advanced packaging technology development, according to industry sources......»»
IC packaging materials suppliers expect pick-up in demand for HPC substrates
IC packaging materials suppliers and distributors anticipate an increase in demand for HPC substrates in the second half of 2023, while demand for display driver ICs (DDI) will stabilize in the second quarter of the year, according to industry source.....»»
Everlight sees sales bottom out shortly
Everlight Electronics, an LED packaging service provider, expects its business to bottom out shortly as it has seen a pick-up in shipment momentum......»»
IC packaging materials demand to hit bottom in 1Q23, but recover through rest of 2023, says CWE chair
The IC packaging materials sector will definitely hit rock bottom in the first quarter of 2023, but will then recover steadily in the rest of year, according to Chang Wah Electromaterials (CWE) chairman Canon Huang......»»
Researchers develop elastic material that is impervious to gases and liquids
An international team of researchers has developed a technique that uses liquid metal to create an elastic material that is impervious to both gases and liquids. Applications for the material include use as packaging for high-value technologies that.....»»
Study confirms that milk"s packaging influences its flavor
The dairy industry strives to preserve the quality and safety of milk products while maintaining the freshest possible taste for consumers. To date, the industry has largely focused on packaging milk in light-blocking containers to preserve freshness.....»»
Unraveling the protein map of the cell"s mitochondria
Mitochondria are responsible for the energy supply of the organism and fulfill functions in metabolic and signaling processes. Researchers at the University Hospital Bonn (UKB) and the University of Freiburg have gained systematic insight into the or.....»»