Innolux stepping into IC packaging
Innolux will remodel a 3.5G LCD panel factory to house an IC packaging line, with production to begin in second-half 2023, according to company president James Yang......»»
Market Cap 100: ASE keeps deepening advanced packaging solution development
Taiwan-based ASE Technology Holding (ASEH) ranked 72 in the "2023 Asia Supply Chain Market Cap 100 Ranking," representing a significant improvement from the 81 it held a year earlier......»»
Innolux, Giantplus post mixed results for 2022
Panel makers Innolux and Giantplus have reported mixed results for 2022. Innolux experienced an over 30% revenue decline, while Giantplus, specializing in small- and medium-size panels, generated slight revenue growth......»»
Nanoplastics unexpectedly produce reactive oxidizing species when exposed to light
Plastics are ubiquitous in our society, found in packaging and bottles as well as making up more than 18% of solid waste in landfills. Many of these plastics also make their way into the oceans, where they take up to hundreds of years to break down i.....»»
Innolux cuts into supply chain of primary car vendors
Innolux, along with subsidiary CarUX, has cut into the supply chain of many significant car vendors, including BMW, Tesla, Volkswagen, General Motors (GM), Audi and Geely Auto......»»
Everlight expects invisible LED demand to pick up in 1H23
LED packaging service provider Everlight Electronics expects demand for invisible LED devices to pick up gradually in the first half of 2023 and for other visible models to come one quarter later......»»
Taiwan OSATs poised to slightly cut quotes for 2023
Taiwan's OSATs are expected to slightly cut packaging or testing quotes for 2023 to bolster their capacity utilization rates, with price ranges up for negotiation with clients to gradually return to pre-pandemic levels, according to industry sources......»»
Can Huawei restore consumer business by stepping into EVs?
While China-based Huawei Technologies has been frustrated in smartphone business operation because the IC design subsidiary HiSilicon Technologies is running out of 5G smartphone-use application processors (APs), Huawei has newly participated in deve.....»»
Delivery lead times for IC packaging and testing machines shorten notably
Delivery lead times for IC packaging and testing machines have shortened notably amid weakening demand and improving supply of basic ICs used in the machines, according to industry sources......»»
Taiwan-based LCD panel makers target smart applications
Global factors have had a major impact on LCD panel demand in 2022, causing industry players to expect demand to remain weak through the first half of 2023. Taiwan-based LCD panel makers such as AU Optronics (AUO) and Innolux are making moves to boos.....»»
Government subsidies may allow China IC backend houses to cut prices
With China stepping up the subsidizing of its IC industry, China-based IC backend houses would be able to initiate effective price cuts to attract orders in 2023, according to industry sources......»»
France bans disposable packaging, utensils in fast-food restaurants
Fast-food eateries in France will soon no longer be able to use disposable containers, plates, cups and tableware for clients eating in, the latest measure from a 2020 law to combat waste and encourage recycling......»»
Tesla stock rallies on prospect of Elon Musk stepping back as Twitter CEO
Users cast more than 17.5 million votes, and 57.5 percent were in favor of him relinquishing his role as Twitter CEO......»»
A challenge for Foxconn to venture into chiplet packaging segment
Foxconn Technology's (Hon Hai Precision Industry) latest announcement to invite Shang-Yi Chiang, TSMC veteran and former SMIC executive, as the chief strategy officer of its semiconductor group has brought both Chiang and the company into internation.....»»
Chengdu Silan raises CNY500 million to fund automotive IC packaging biz
Chengdu Silan Semiconductor Manufacturing, a subsidiary of discrete component IDM Silan Microelectronics, has raised CNY500 million (US$71.7 million) from two new Chinese investors to fund its automotive IC packaging business. Government-led Chengdu.....»»
Innolux November revenues down on year
LCD panel maker Innolux has reported consolidated revenue of NT$16.182 billion (US$529.25 million) for November, growing 3.61% sequentially but slipping 39.15% on year......»»
Samsung adjusts semiconductor department for advanced packaging ambition
Samsung Electronics's Device Solutions (DS) division recently adjusted its organization by adding an advanced packaging team under the Test & System Package (TSP) department, according to several industry sources. Analysis pointed out that these adju.....»»
SpaceX gives rival"s internet satellites ride to orbit
SpaceX launched internet satellites for a competitor Thursday, stepping in to help after the London-based OneWeb company halted its flights with Russia over the invasion of Ukraine......»»
Tata eyes chip packaging and fabrication business
Amid a chip shortage and the US-China political tension, Indian companies are foraying into semiconductor manufacturing, with Tata showing interest in ATMP and chip fabrication......»»
OSATs still uncertain about constructing facilities in US
Though TSMC is building advanced wafer fabs in the US, Taiwanese OSAT companies still have concerns about constructing facilities there to provide cutting-edge packaging services such as those for chiplets or mainstream flip-chip (FC) processes, acco.....»»
Japan looking to next-generation semiconductors, says JST president
While the US leads in IC design, Taiwan leads in wafer foundry and IC packaging/testing, and South Korea leads in DRAM/flash memory, Japan is focusing on development of next-generation semiconductors, according to president Hashimoto Kazuhito for Jap.....»»